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| LASERELIANCE TECHNOLOGIES: *Laser Machining, Drilling, Scribing, and Other Laser Job Shop Services on a Variety of Materials Including Ceramics, Alumina, Metals, Plastics, Rubber, and Composite Materials *Specializing in but Not Limited to the Hybrid Microelectronics Industry
MARCH INSTRUMENTS, INC.: *Automated In-Line Plasma Systems *Batch Plasma Systems *Reactive Ion Etching (RIE) Systems * Contact Angle Measurement Systems * Hydrogen Generators
MAT(MICRO ASSEMBLY TECHNOLOGIES, LTD): *High Accuracy Die Bonders* Die Stacking, Mems Applications * Eutectic Bonding * Flip Chip Bonding
MIDAS TECHNOLOGY, INC.: *HGRS (HOT GAS REWORK STATION): quick, circuit-safe removal of components from conductive epoxy, high-temperature solder, and eutectic attach * DE-LIDDERTM: equipment for reseal-ready removal of lids from hermetic packages such as butterfly and flatpaks, optical modules, round packages and TO-style headers
ROYCE INSTRUMENTS:*Universal Bond Tester *Wire Pull and Bond Shear Test Systems *Pick & Place System with Non Surface Contact *Laser Diode Stacking Systems
SEFAR/MICROCIRCUIT ENGINEERING:*Precision Stencil Screens *Clean Room Wipes *Squeegees *Metal Stencils & Masks
SST INTERNATIONAL: * Vacuum & Pressure Furnaces* Wafer Bonding systems* Graphite Machining Services* Flux-free and Void-free Soldering* Brazing and Glass Sealing solutions
SYSTEMS DESIGN & FABRICATION: *Custom Vacuum Systems, Chambers, and Components THINKY CORP: *Planetary Mixer for Epoxies, Slurries, Paste, Solder, Powders * Vacuum Mixers Lab & Production Sizes
ULTRASONIC SYSTEMS, INC:* Precision Coating Systems* Nozzle-less Coating Systems
ULTRASOURCE, INC: *Custom Thin Film Circuits (DC through 300GHz) *Alumina & Silicon
Resistor Chips * Integrated MIM Capacitors *Metalized Substrates *Etching Services (Thick & Thin Film) * Dicing Services * Selectively Deposited Au/Sn Solder * Solid Filled Vias | |
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